Yavne, Israel, March 21st, 2016; At a pre-drupa event held at its headquarters last week, Highcon announced a new portfolio of products to be launched at drupa this year. Existing customers, potential customers, press and analysts attended this first demonstration of the new products  delivering the benefits of digital cutting and creasing to new markets.

Highcon customers all over the world have been supplying the constantly growing requirements of hundreds of brands by leveraging digital finishing capabilities for a wide range of applications. As the result of the lessons learned from these customers, at drupa 2016, Highcon will be showcasing an entire portfolio of digital solutions whose key focus is on enabling an even wider range of applications that address the needs of packaging and printing companies.

The drupa portfolio offers a full range of digital finishing products from entry level to top-of-the-line production capability, all based on Highcon’s core cutting and creasing technology. All these products will be running on Highcon’s 1000m² booth in Hall 9, C50.

Highcon Beam – digital cutting and creasing for mainstream production

The Highcon Beam extends the digital finishing revolution to mainstream production. With a speed of up to 5,000 sheets per hour, this breakthrough machine was developed as a robust solution to the challenges facing folding carton converters and print service providers.

Highcon Pulse – digital cutting and creasing in a B2/29 in. format

The Highcon Pulse brings the digital post-print revolution to print service providers and converters with a seamless integration into existing B2 / 29 in. sheet size workflows. Highcon’s digital cutting and creasing technology enables an in-house controlled digital system that delivers improved responsiveness, design flexibility and entry into a wide range of applications in numerous markets.

Highcon Euclid III – application versatility made possible by digital cutting and creasing

The Highcon Euclid III addresses today’s operational challenges and answers tomorrow’s growth needs by opening the door to countless new opportunities in high value applications and markets; from packaging and commercial print applications to Web-to-Pack and even 3D modeling. The 3D optional module with Highcon’s Rapid Layer Manufacturing technology offers customers a wide range of capabilities with disruptive speed, size and costs that unleash the power of paper.  3D models are created based on any type of substrate, including recycled board and even used offset make-ready sheets.

To learn more about this exciting new application, and the entire portfolio, listen to the webinar https://youtu.be/uqqA4c6IZIU